The 400 Points Half Breadboard is a compact solderless prototyping board designed for building and testing electronic circuits without soldering. With 400 tie points, it is ideal for Arduino, ESP32, Raspberry Pi, IoT, robotics, sensor interfacing, and DIY electronics projects. Its compact size makes it perfect for portable prototypes and educational use.
Features
- Full Name: 400 Points Half-Size Solderless Breadboard
- 400 tie points for circuit prototyping
- Solderless and reusable design
- Compact and lightweight
- High-quality phosphor bronze spring contacts
- Self-adhesive backing for easy mounting
- Compatible with standard 2.54 mm (0.1″) pitch components
- Easy to expand with multiple breadboards
Specifications
| Specification | Value |
|---|---|
| Product Type | Solderless Breadboard |
| Total Tie Points | 400 |
| Terminal Strip Points | 300 |
| Power Rail Points | 100 |
| Pitch | 2.54 mm (0.1 Inch) |
| Contact Material | Phosphor Bronze with Nickel Plating |
| Base Material | ABS Plastic |
| Maximum Voltage | 36V DC (Recommended) |
| Maximum Current | 2A (Recommended) |
| Mounting | Self-Adhesive Backing |
| Color | White |
Layout Configuration
| Section | Description |
|---|---|
| Terminal Strips | 300 Tie Points for Components |
| Power Rails | 2 Power Rails (Positive & Negative) |
| Center Gap | Suitable for DIP ICs |
Note: The center gap is designed for Dual In-line Package (DIP) integrated circuits, allowing easy insertion of ICs without shorting adjacent pins.
Applications
- Arduino projects
- ESP32 and Raspberry Pi projects
- Electronic circuit prototyping
- Robotics
- IoT development
- Sensor interfacing
- Educational electronics
- DIY electronics
- Embedded systems
Advantages
- No soldering required
- Reusable and durable
- Compact size for portable projects
- Easy circuit modifications
- Supports rapid prototyping
- Compatible with standard electronic components
- Cost-effective for learning and development
Size
| Specification | Value |
|---|---|
| Dimensions | Approx. 82 × 55 × 9 mm |
| Tie Point Pitch | 2.54 mm |
| Weight | Approx. 40 g |
Package Includes
- 1 × 400 Points Half-Size Solderless Breadboard
Note: This breadboard is intended for low-voltage, low-current electronic prototyping only. Do not use it with AC mains voltage or circuits exceeding the recommended voltage and current ratings. Ensure component leads match the standard 2.54 mm spacing for secure and reliable connections.






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