The 840 Points Solderless Breadboard is a reusable prototyping board designed for building and testing electronic circuits without soldering. With 840 tie points, it is ideal for Arduino, ESP32, Raspberry Pi, IoT, robotics, sensor interfacing, and DIY electronics projects. The board features dual power rails and a durable self-adhesive backing for easy mounting.
Features
- Full Name: 840 Points Solderless Breadboard
- 840 tie points for circuit prototyping
- Solderless and reusable design
- Dual power rails for easy power distribution
- High-quality phosphor bronze spring contacts
- Self-adhesive backing
- Interlocking design for expansion
- Compatible with standard 2.54 mm (0.1″) pitch components
Specifications
| Specification | Value |
|---|---|
| Product Type | Solderless Breadboard |
| Total Tie Points | 840 |
| Terminal Strip Points | 640 |
| Power Rail Points | 200 |
| Pitch | 2.54 mm (0.1 Inch) |
| Contact Material | Phosphor Bronze with Nickel Plating |
| Base Material | ABS Plastic |
| Maximum Voltage | 36V DC (Recommended) |
| Maximum Current | 2A (Recommended) |
| Mounting | Self-Adhesive Backing & Mounting Holes |
| Color | White |
Layout Configuration
| Section | Description |
|---|---|
| Terminal Strips | 640 Tie Points for Components |
| Power Rails | 2 Positive (+) and 2 Negative (−) Rails |
| Center Gap | Suitable for DIP ICs |
Note: The center gap is designed for Dual In-line Package (DIP) integrated circuits, allowing ICs to be inserted without shorting the pins.
Applications
- Arduino projects
- ESP32 and Raspberry Pi projects
- Electronic circuit prototyping
- Robotics
- IoT development
- Sensor interfacing
- Educational electronics
- DIY electronics
- Embedded systems
Advantages
- No soldering required
- Reusable and durable
- Easy circuit modifications
- Supports rapid prototyping
- Compatible with standard electronic components
- Self-adhesive mounting
- Cost-effective for development and testing
Size
| Specification | Value |
|---|---|
| Dimensions | Approx. 165 × 55 × 9 mm |
| Tie Point Pitch | 2.54 mm |
| Weight | Approx. 90 g |
Package Includes
- 1 × 840 Points Solderless Breadboard
Note: This breadboard is intended for low-voltage, low-current electronic prototyping. Avoid using it with high-voltage AC mains or circuits exceeding the recommended voltage and current ratings. Ensure component leads are compatible with the 2.54 mm breadboard spacing for secure connections.






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