Mini Solderless Breadboard (170 Tie-Points)

The 170 Tie-Point Mini Solderless Breadboard is a compact and reusable prototyping board designed for building and testing electronic circuits without soldering. Its small size makes it ideal for Arduino, ESP32, Raspberry Pi, sensor modules, DIY electronics, robotics, and educational projects where space is limited.

Features

• Full Name: 170 Tie-Point Mini Solderless Breadboard
• No soldering required
• Compact and portable design
• 170 tie-point layout for small circuits
• Reusable for multiple projects
• Strong nickel-plated spring contacts
• Compatible with standard jumper wires and DIP ICs
• Self-adhesive backing for easy mounting
• Multiple breadboards can be interconnected
• Available in various colors

Specifications

Applications / Uses

• Arduino projects
• ESP32 and Raspberry Pi prototyping
• DIY electronics
• Sensor testing
• Breadboard experiments
• Robotics
• Educational electronics
• Prototype circuit development
• Embedded system testing
• Small analog and digital circuits
• IoT projects
• Electronics training kits

Layout Description

• 170 tie points arranged in interconnected rows.
• Center gap allows placement of DIP ICs and modules.
• Can be connected with additional mini breadboards for larger circuits.

Size

• Length: Approx. 47 mm
• Width: Approx. 35 mm
• Height: Approx. 9 mm
• Tie Points: 170
• Weight: Approximately 15–20 g

Package Includes

• 1 × 170 Tie-Point Mini Solderless Breadboard

Note: This mini breadboard is compatible with 2.54 mm (0.1 inch) pitch components, jumper wires, and DIP ICs. It is ideal for compact prototyping and can be combined with multiple breadboards to create larger circuit layouts.