The BGA Flux Paste is a soldering aid designed to improve solder wetting and bonding during electronic assembly and rework. It is suitable for BGA, SMD, PCB soldering, and desoldering applications, helping reduce oxidation and improve solder joint quality.

Features

• Designed for BGA and SMD soldering
• Helps improve solder wetting and flow
• Reduces oxidation during soldering
• Suitable for rework and repair
• Syringe-style packaging for precise application
• Easy to apply to small soldering areas
• Suitable for PCB repair and component replacement
• Useful for both professional and DIY electronics work

Specifications

Applications

• BGA chip rework
• SMD component soldering
• PCB repair
• IC replacement
• Desoldering and rework
• Fine-pitch component soldering
• Mobile phone and electronics repair
• DIY electronics projects

Advantages

• Improves solderability and wetting
• Helps produce cleaner and more reliable solder joints
• Precise application with syringe packaging
• Convenient for small and fine-pitch components
• Useful for BGA and SMD rework
• Easy to handle during PCB repair

Package Includes

• 1 × 20g BGA Soldering Flux Paste
• 1 × Syringe Applicator

Note

Apply a small amount of flux to the required soldering area before soldering or rework. Avoid excessive application and clean the PCB after soldering when required. Store the flux in a cool, dry place and keep the container properly sealed when not in use.